產(chǎn)品介紹 Product introduction

PI復(fù)合硅膠皮 PI composite silicone rubber

PI復(fù)合硅膠皮是一款由PI film與高彈性有機(jī)硅橡膠材料結(jié)合而成的新型高分子材料，材料具有超薄、超平整度、的韌性等主要特性；它有力地結(jié)合了有機(jī)硅膠分子的導(dǎo)熱性能、緩沖性能以及PI的獨(dú)特韌性及穩(wěn)定度，超薄且平整的材料是與傳統(tǒng)緩沖材大之區(qū)別，其還具有厚度公差小、導(dǎo)熱速度快、單個(gè)位置使用率高等優(yōu)點(diǎn)，能滿足許多有特殊要求的設(shè)備使用。主要適用于高要求的熱壓設(shè)備，可隔絕超高溫產(chǎn)生的硅油與產(chǎn)品的直接接觸，對溫度有緩沖作用，使溫度較為均勻，平坦的表面可防止異物的殘留，以免影響熱壓頭因有殘留雜物而造成的熱壓效果，同時(shí)具有隔離保護(hù)作用。

PI composite silicone rubber is a new polymer material composed of PI film and high elastic silicone rubber. The material has the main characteristics of ultra-thin, super flatness and perfect toughness; It effectively combines the thermal conductivity and cushioning performance of organic silica gel molecules and the unique toughness and stability of PI. The ultra-thin and flat material is the biggest difference from the traditional buffer material. It also has the advantages of small thickness tolerance, fast thermal conductivity and high utilization rate at a single position, which can meet the use of many equipment with special requirements. It is mainly applicable to the hot pressing equipment with high requirements. It can isolate the direct contact between the silicone oil produced by ultra-high temperature and the product, buffer the temperature and make the temperature more uniform. The super flat surface can prevent the residue of foreign matters, so as not to affect the hot pressing effect caused by residual sundries of the hot pressing head, and has the function of isolation and protection.

產(chǎn)品型號(hào)Product model：

PI-G-0.1,   PI-G-0.15  ,PI-G-0.2 ,   PI-G-0.25,  PI-G-0.3  PI-G-0.45（灰色導(dǎo)熱系列）

PI-B-0.1,   PI-B-0.15  ,PI-B-0.2 ,   PI-B-0.25,  PI-B-0.3  PI-B-0.45(黑色抗靜電系列)

產(chǎn)品用途：

1、適用于各類新型（柔性屏、3D眼鏡、OREDT、TP）COG與FOG綁定加熱壓合過程的防護(hù)、緩沖和隔離，可替代目前普通設(shè)備使用的氟材料、硅材料以及玻璃纖維等復(fù)合材料。

2、主要替代目前傳統(tǒng)使用性能單一的壓合材料，與傳統(tǒng)壓合材料比有更輕薄、更平整、導(dǎo)熱快、受熱均勻、不滲油等特點(diǎn)。

3、特別適用于惡劣環(huán)境(高溫、耐油、高強(qiáng)度、高頻率)生產(chǎn)環(huán)境下的使用。

Usages of product:

1. It can be applied to bonding procedure of COG and FOG for FPC,3D eyeglasses,OEDT and TP etc. As buffering tools.it can replace some composite glass fiber material such as fluorine,silicone etc。

2. It can replace traditional compress material majorly. Comparing to traditional composite materials, SIC products are more thin and flat. The thermal conductivity performs fast and evenly。

3. It can be applied to severe environment(high-temperature,high pressure,high frequency etc)。

產(chǎn)品特點(diǎn)：

1、厚度薄，厚度公差極小、表面平整、導(dǎo)熱均勻。

2、耐高壓、耐高溫、耐老化。

3、不出油。

Features of product:

1.The thickness is thin, the thickness tolerance is very small, the surface is flat and the heat conduction is uniform.

2. High pressure resistance, high temperature resistance and aging resistance.

3. No oil。

產(chǎn)品規(guī)格：

1、（厚T：0.05--1mm*（寬W：5mm-1000mm）*（長L：5-100m）。

2、黑色(黑色抗靜電系列)。

3.灰色（灰色導(dǎo)熱系列）。

Product specifications:

1. (Thickness 0.05--1mm) * (width 5mm-1000mm) * (length 5-100m)。

2. Black (black antistatic Series)。

3.Grey (grey Series)。

PI復(fù)合硅膠皮性能參數(shù)：