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產(chǎn)品介紹:Product introduction
FPC層壓綠色硅膠墊
FPC層壓綠色硅膠墊(綠硅膠Green silicone pad)是一種由有機硅橡膠添加耐高溫納米材料及導熱粉末混合而成的獨特合成彈性體。它地平衡了機械性質和化學性質,能滿足今天許多苛刻的應用場合要求。主要適用于熱壓層壓設備,F(xiàn)PC、PCB等產(chǎn)品的生產(chǎn)工藝,能與該產(chǎn)品直接接觸而不吸出硅膠油,對溫度有一定的緩沖作用,使溫度較為均勻,隔離被熱壓產(chǎn)品與熱壓頭直接接觸,以免熱壓頭有殘留雜物影響其平坦度,同時具有防止靜電漏電的隔離保護作用。
Products introduction:
FPC laminated green silicone pad is a unique synthetic elastomer composed of silicone rubber, high temperature resistant nano materials and heat conductive powder. It perfectly balances mechanical and chemical properties and can meet the requirements of many demanding applications today. It is mainly applicable to the production process of hot laminating equipment, FPC, PCB and other products. It can directly contact with the product without sucking out silicone oil. It has a certain buffer effect on the temperature, so as to make the temperature more uniform. It can isolate the hot pressed products from direct contact with the hot indenter, so as to avoid residual sundries affecting its flatness. At the same time, it can prevent electrostatic leakage。
產(chǎn)品型號:
Product models:
FPC-G-0.8MM; FPC-G-1.6MM; FPC-R-0.8MM ; FPC-R-1.6MM(常規(guī)系列)
FPC-G-N-0.8MM; FPC-G-N-1.6MM;(無硅油系列)
產(chǎn)品用途:
1、適用于各類FPC柔性線路板生產(chǎn)工藝壓合過程的導熱,緩沖和隔離。
2、各類其它設備進行壓合,隔離、緩沖、導熱,絕緣而使用。
Usages of the products;
1.It is suitable for heat conduction, cushioning and isolation in the crimping process of various FPC flexible circuit boards.
2. All kinds of other equipment are used for pressing, isolation, buffering, heat conduction and insulation.
產(chǎn)品特點:
1、耐高溫(-40℃至320℃)、耐高壓、不出油。
2、導熱迅速、均勻,節(jié)約能源、節(jié)省成本。
3、良好的緩沖性、回彈性好、韌性極強,延長加熱板和層壓板的使用壽命。
4、具有良好絕緣性及良好的壓力穩(wěn)定性,耐用、使用周期長。
Features of products:
1. High temperature resistance(-40℃ to 320℃),high pressure resistance.
2. Thermal conductivity performs well and evenly.
FPC層壓硅膠板性能參數(shù):
Product model 產(chǎn)品型號 | thickness 厚度(mm) | colour 顏 色 | hardness 硬度(A) | Pressure resistance 耐壓力(MPA) | proportion 比重(g/mm3) | Recommended temperature 推薦使用溫度°C |
FPC-G-0.8MM | 1.6 | 綠色 | 55-65 | 10 | 1.2-1.3 | —40--250 |
Compression deformation rate 壓縮變形率 % | Thermal conductivity 熱導率 W/(㎡*k) Btu/(ft2*h*°F) | Dielectric constant 介電常數(shù) | Dielectric strength 介電強度volts/mil | tensile strength 拉伸強度(Mpa) | Maximum temperature 大溫度°C | |
≤10 | 0.3 | 2.1 | 3.5 | 405 | 0.8 | 280 |
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